AOYUE968A+ Hot Air Gun Soldering Iron

Fr324,000

AOYUE968A+ Hot Air Gun Soldering Iron is designed to remove and/or repair surface mounted devices such as SOIC, CHIP, QFP, BLCC, BGA, and so on. It has an auto-cooling feature to lower nozzle temperature after each usage, It is designed with knob type controls for easy temperature adjustment, coupled with dual line digital display of both the set and actual temperature. Its high powered solder iron has a smoke absorber attached to it to extract solder fumes from the source, The soldering iron features digital calibration, and configurable auto sleep.

 

Out of stock

Notify me when stock available

SKU: EQP14469 Category:

Description

Product Description

The air volume and the temperature can be set or adjusted in a wide range, the nozzles can be easily replaced so that each component is soldered by using the suitable nozzle, air and temperature setting. The heating elements as well as the nozzles comply with the international standard; suitable for the most SMD components, for instance LEDs, SOIC, CHIP, QFP, PLCC and BGA.

The antistatic design as well as the microcontroller of the AOYUE Int 968 A+ prevents PCBs and electronic components from being damaged due to static charging. The control panel as well as the whole rework station are easy to manage and therefore ensure an easy handling. The built-in smoke absorber extracts the fume directly from where it is generated. The temperature of the soldering ironis shown on the digital display and can be easily adjusted by using a rotary knob ensuring a fast and precise temperature setting.

The soldering station informs the user via display about possible malfunctions on the sensors or on the heating elements.
By blowing, the Auto-cooling function provides for the lowest possible temperature on the heating element before being switched off in order to extend the life of the heating element. Of course, this repairing system can also be used for the shrinking of shrink hoses and is indispensable in the field of chip tuning, repairing mobile phones, laptops and video game consoles.

• High heating capacity
• SMD fine soldering iron
• Highest heating-up
• Exact options for adjustment
• Automatic cooling – and follow up phase
• Fan nozzles in compliance with international standard
• Suitable for SOIC, CHIP, QFP, PLCC, PSOP, SSOP, BGA etc.

 

The station is delivered with a transport safety (a red cross screw that secures the pump during transport), which has to be removed BEFORE using the station for the very first time! After removing the safety transport the station is ready to be operated. You don´t need but 5 minutes only to have a complete hot air station The temperature as well as the air flow can be adjusted via “AIR” and “Heater”.

SPECIFICATIONS:

  • Main Station Dimensions: 188(w) x 126(h) x 250(d) mm
  • Weight: 5.25Kg

SOLDERING IRON

  • Power Consumption: 70W
  • Temperature Range: 200°C – 480°C
  • Heating Element with Tip: Ceramic Heater
  • Output Voltage: 24V
  • Tip to Ground Resistance: Below 2  Ω
  • Tip to Ground Potential: Below 2mV

HOT AIR

  • Power Consumption: 550W
  • Temperature Range: 100°C – 480°C
  • Heating Element: Metal Heating Core
  • Nozzle to Ground Resistance: Below 2  Ω
  • Pump/Motor Type: Diaphragm Pump
  • Air Capacity: 23 l /min (max)

Document